Issued Patents 2022
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11462483 | Wire bond wires for interference shielding | Abiola Awujoola, Zhuowen Sun, Wael Zohni, Willmar Subido | 2022-10-04 |
| 11450638 | Bump bond structure for enhanced electromigration performance | Dibyajat Mishra, Tomoko Noguchi, Luu Thanh Nguyen, Anindya Poddar, Makoto Yoshino +1 more | 2022-09-20 |
| 11410875 | Fan-out electronic device | Hau Nguyen, Woochan Kim, Yi Yan, Luu Thanh Nguyen, Anindya Poddar +3 more | 2022-08-09 |
| 11367699 | Integrated circuit backside metallization | Hiroyuki Sada, Shoichi Iriguchi, Genki Yano, Luu Thanh Nguyen, Anindya Poddar +2 more | 2022-06-21 |