Issued Patents 2022
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11498831 | Structures for packaging stress-sensitive micro-electro-mechanical system stacked onto electronic circuit chip | Kurt Peter Wachtler, Makoto Yoshino, Ayumu Kuroda, Brian E. Goodlin, Karen Hildegard Ralston Kirmse +2 more | 2022-11-15 |
| 11482442 | Subring for semiconductor dies | Matthew John Sherbin, Michael Todd Wyant, Dave Charles Stepniak, Sada Hiroyuki, Shoichi Iriguchi | 2022-10-25 |
| 11469141 | Laser dicing for singulation | Michael Todd Wyant, Dave Charles Stepniak, Matthew John Sherbin, Sada Hiroyuki, Shoichi Iriguchi | 2022-10-11 |
| 11367699 | Integrated circuit backside metallization | Hiroyuki Sada, Shoichi Iriguchi, Luu Thanh Nguyen, Ashok S. Prabhu, Anindya Poddar +2 more | 2022-06-21 |