Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11482442 | Subring for semiconductor dies | Matthew John Sherbin, Michael Todd Wyant, Sada Hiroyuki, Shoichi Iriguchi, Genki Yano | 2022-10-25 |
| 11469141 | Laser dicing for singulation | Michael Todd Wyant, Matthew John Sherbin, Sada Hiroyuki, Shoichi Iriguchi, Genki Yano | 2022-10-11 |