Issued Patents 2022
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11450638 | Bump bond structure for enhanced electromigration performance | Dibyajat Mishra, Ashok S. Prabhu, Tomoko Noguchi, Luu Thanh Nguyen, Anindya Poddar +1 more | 2022-09-20 |
| 11410875 | Fan-out electronic device | Woochan Kim, Yi Yan, Luu Thanh Nguyen, Ashok S. Prabhu, Anindya Poddar +3 more | 2022-08-09 |
| 11367699 | Integrated circuit backside metallization | Hiroyuki Sada, Shoichi Iriguchi, Genki Yano, Luu Thanh Nguyen, Ashok S. Prabhu +2 more | 2022-06-21 |