Issued Patents 2022
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11495553 | Wire bonding between isolation capacitors for multichip modules | Jeffrey Alan West, Byron Lovell Williams | 2022-11-08 |
| 11495658 | Hybrid high and low stress oxide embedded capacitor dielectric | Elizabeth Costner Stewart, Jeffrey Alan West | 2022-11-08 |
| 11476189 | Resonant inductive-capacitive isolated data channel | Klaas De Haan, Mikhail Valeryevich Ivanov, Tobias Bernhard Fritz, Swaminathan Sankaran | 2022-10-18 |
| 11270930 | Laminate stacked on die for high voltage isolation capacitor | — | 2022-03-08 |
| 11251138 | Through wafer trench isolation between transistors in an integrated circuit | Scott R. Summerfelt, Sreeram Subramanyam Nasum, Peter Smeys, Benjamin Stassen Cook | 2022-02-15 |
| 11222945 | High voltage isolation structure and method | Kannan Soundarapandian | 2022-01-11 |