Issued Patents 2022
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11532693 | Passive components with improved characteristics | Byron Lovell Williams, Elizabeth Costner Stewart, Thomas Dyer Bonifeld | 2022-12-20 |
| 11495553 | Wire bonding between isolation capacitors for multichip modules | Thomas D. Bonifield, Byron Lovell Williams | 2022-11-08 |
| 11495658 | Hybrid high and low stress oxide embedded capacitor dielectric | Elizabeth Costner Stewart, Thomas D. Bonifield | 2022-11-08 |
| 11348883 | High voltage isolation barrier with electric overstress integrity | — | 2022-05-31 |
| 11227852 | Integrated circuit packaging | Honglin Guo, Jason Chien, Byron Lovell Williams, Anderson Li, Arvin Nono Verdeflor | 2022-01-18 |