Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11538740 | Leads for semiconductor package | Yuh-Harng Chien, J K Ho | 2022-12-27 |
| 11227852 | Integrated circuit packaging | Honglin Guo, Byron Lovell Williams, Jeffrey Alan West, Anderson Li, Arvin Nono Verdeflor | 2022-01-18 |