Issued Patents 2022
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11227852 | Integrated circuit packaging | Honglin Guo, Jason Chien, Byron Lovell Williams, Jeffrey Alan West, Anderson Li | 2022-01-18 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11227852 | Integrated circuit packaging | Honglin Guo, Jason Chien, Byron Lovell Williams, Jeffrey Alan West, Anderson Li | 2022-01-18 |