Issued Patents 2022
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11532693 | Passive components with improved characteristics | Jeffrey Alan West, Elizabeth Costner Stewart, Thomas Dyer Bonifeld | 2022-12-20 |
| 11495553 | Wire bonding between isolation capacitors for multichip modules | Thomas D. Bonifield, Jeffrey Alan West | 2022-11-08 |
| 11227852 | Integrated circuit packaging | Honglin Guo, Jason Chien, Jeffrey Alan West, Anderson Li, Arvin Nono Verdeflor | 2022-01-18 |