Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11424183 | IC with thin film resistor with metal walls | Qi-Zhong Hong, Benjamin James Timmer, Gregory B. Shinn | 2022-08-23 |
| 11227852 | Integrated circuit packaging | Jason Chien, Byron Lovell Williams, Jeffrey Alan West, Anderson Li, Arvin Nono Verdeflor | 2022-01-18 |