Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11538740 | Leads for semiconductor package | Jason Chien, J K Ho | 2022-12-27 |
| 11444012 | Packaged electronic device with split die pad in robust package substrate | Chang-Yen Ko, Chih-Chien Ho | 2022-09-13 |