Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11444012 | Packaged electronic device with split die pad in robust package substrate | Yuh-Harng Chien, Chang-Yen Ko | 2022-09-13 |
| 11342247 | Leadframe with vertically spaced die attach pads | Chia-Yu Chang, Steven Su | 2022-05-24 |