Issued Patents 2022
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11487206 | Methods and apparatus for digital material deposition onto semiconductor wafers | Daniel Lee Revier, Benjamin Stassen Cook, Scott R. Summerfelt | 2022-11-01 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11487206 | Methods and apparatus for digital material deposition onto semiconductor wafers | Daniel Lee Revier, Benjamin Stassen Cook, Scott R. Summerfelt | 2022-11-01 |