Issued Patents 2022
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11487206 | Methods and apparatus for digital material deposition onto semiconductor wafers | Sean Chang, Benjamin Stassen Cook, Scott R. Summerfelt | 2022-11-01 |
| 11417540 | 3D printed semiconductor package | Benjamin Stassen Cook | 2022-08-16 |
| 11404270 | Microelectronic device substrate formed by additive process | Benjamin Stassen Cook | 2022-08-02 |
| 11355414 | Nanoparticle matrix for backside heat spreading | Benjamin Stassen Cook, Nazila Dadvand, Archana Venugopal | 2022-06-07 |
| 11271296 | Molded packaged antenna | Leon Stiborek, Alexey Berd | 2022-03-08 |