Issued Patents 2022
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11476175 | Sensor package cavities with polymer films | Leslie Edward Stark | 2022-10-18 |
| 11444048 | Shaped interconnect bumps in semiconductor devices | — | 2022-09-13 |
| 11430722 | Integration of a passive component in a cavity of an integrated circuit package | Jeffrey Anthony Morroni, Rajeev Joshi, Sujan Kundapur Manohar, Yogesh Kumar Ramadass, Anindya Poddar | 2022-08-30 |
| 11387155 | IC having a metal ring thereon for stress reduction | Amit Sureshkumar Nangia, Siva Prakash Gurrum, Christopher Daniel Manack | 2022-07-12 |
| 11335570 | Multirow gull-wing package for microelectronic devices | — | 2022-05-17 |
| 11282807 | Nanowires plated on nanoparticles | Benjamin Stassen Cook, Ralf Jakobskrueger Muenster | 2022-03-22 |
| 11282770 | Leadless packaged device with metal die attach | Benjamin Stassen Cook, Nazila Dadvand | 2022-03-22 |
| 11264336 | Packaged device carrier for thermal enhancement or signal redistribution of packaged semiconductor devices | — | 2022-03-01 |
| 11239195 | Nanowire interfaces | Benjamin Stassen Cook, Ralf Jakobskrueger Muenster | 2022-02-01 |