Issued Patents 2022
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11538742 | Packaged multichip module with conductive connectors | Manu J. Prakuzhy, Saumya Gandhi | 2022-12-27 |
| 11521904 | Wire bond damage detector including a detection bond pad over a first and a second connected structures | Hung-Yun Lin | 2022-12-06 |
| 11430719 | Spot-solderable leads for semiconductor device packages | Manu A. Prakuzhy, Daryl R. Heussner, Stefan Wlodzimierz Wiktor, Ken Pham | 2022-08-30 |
| 11387155 | IC having a metal ring thereon for stress reduction | Amit Sureshkumar Nangia, Sreenivasan K. Koduri, Christopher Daniel Manack | 2022-07-12 |