Issued Patents 2022
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11430719 | Spot-solderable leads for semiconductor device packages | Siva Prakash Gurrum, Daryl R. Heussner, Stefan Wlodzimierz Wiktor, Ken Pham | 2022-08-30 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11430719 | Spot-solderable leads for semiconductor device packages | Siva Prakash Gurrum, Daryl R. Heussner, Stefan Wlodzimierz Wiktor, Ken Pham | 2022-08-30 |