Issued Patents 2022
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11443996 | Zinc layer for a semiconductor die pillar | Nazila Dadvand, Keith Edward Johnson, Salvatore Frank Pavone | 2022-09-13 |
| 11410947 | Brass-coated metals in flip-chip redistribution layers | Vivek Swaminathan Sridharan, Nazila Dadvand, Salvatore Frank Pavone, Patrick Francis Thompson | 2022-08-09 |
| 11387155 | IC having a metal ring thereon for stress reduction | Amit Sureshkumar Nangia, Sreenivasan K. Koduri, Siva Prakash Gurrum | 2022-07-12 |
| 11380637 | Efficient redistribution layer topology | Vivek Swaminathan Sridharan, Joseph Liu | 2022-07-05 |
| 11362020 | Flipchip package with an IC having a covered cavity comprising metal posts | Jonathan Andrew Montoya, Jovenic Romero Esquejo, Salvatore Frank Pavone | 2022-06-14 |
| 11362047 | Integrated system-in-package with radiation shielding | Vivek Swaminathan Sridharan, Yiqi Tang, Rajen Manicon Murugan, Liang Wan, Hiep Xuan Nguyen | 2022-06-14 |