Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11362020 | Flipchip package with an IC having a covered cavity comprising metal posts | Christopher Daniel Manack, Jonathan Andrew Montoya, Salvatore Frank Pavone | 2022-06-14 |
| 11239190 | Solder-metal-solder stack for electronic interconnect | Rafael Jose Lizares Guevara, Maricel Fabia Escaño, Arvin Cedric Quiambao Mallari | 2022-02-01 |