Issued Patents 2022
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11443996 | Zinc layer for a semiconductor die pillar | Nazila Dadvand, Keith Edward Johnson, Christopher Daniel Manack | 2022-09-13 |
| 11410947 | Brass-coated metals in flip-chip redistribution layers | Vivek Swaminathan Sridharan, Christopher Daniel Manack, Nazila Dadvand, Patrick Francis Thompson | 2022-08-09 |
| 11362020 | Flipchip package with an IC having a covered cavity comprising metal posts | Christopher Daniel Manack, Jonathan Andrew Montoya, Jovenic Romero Esquejo | 2022-06-14 |