Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11476175 | Sensor package cavities with polymer films | Sreenivasan K. Koduri | 2022-10-18 |
| 11410913 | Multi-layer die attachment | Mohammad Waseem Hussain, Steven Murphy | 2022-08-09 |
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11476175 | Sensor package cavities with polymer films | Sreenivasan K. Koduri | 2022-10-18 |
| 11410913 | Multi-layer die attachment | Mohammad Waseem Hussain, Steven Murphy | 2022-08-09 |