Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11538741 | Multi-chip module leadless package | Matthew David Romig, Wei Zhang, Peter Anthony Fundaro | 2022-12-27 |
| 11410913 | Multi-layer die attachment | Steven Murphy, Leslie Edward Stark | 2022-08-09 |