Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11538741 | Multi-chip module leadless package | Wei Zhang, Mohammad Waseem Hussain, Peter Anthony Fundaro | 2022-12-27 |
| 11525739 | Thermistor die-based thermal probe | Steven Aldred Kummerl, Steve Edward Harrell | 2022-12-13 |