Issued Patents 2022
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11538741 | Multi-chip module leadless package | Matthew David Romig, Mohammad Waseem Hussain, Peter Anthony Fundaro | 2022-12-27 |
| 11518840 | Dynamic covalent thermoset nanocomposites and uses thereof | Jianliang Xiao, Zhanan Zou, Chengpu Zhu | 2022-12-06 |
| 11483455 | Protective connector and lens module | — | 2022-10-25 |
| 11336040 | Conductive terminal with clamping portion and connector assembly using the same | Xiaozhi Fu, Ming Shi, Hongtao Jiang, Dingbing Fan, Shuzhi Wang | 2022-05-17 |