Issued Patents 2022
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11538741 | Multi-chip module leadless package | Matthew David Romig, Wei Zhang, Mohammad Waseem Hussain | 2022-12-27 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11538741 | Multi-chip module leadless package | Matthew David Romig, Wei Zhang, Mohammad Waseem Hussain | 2022-12-27 |