Issued Patents 2022
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11469213 | Systems, methods, and apparatuses for implementing reduced height semiconductor packages for mobile electronics | Georg Seidemann, Thomas Wagner, Bernd Waidhas, Andreas Wolter | 2022-10-11 |
| 11424209 | Wafer level package structure with internal conductive layer | Sven Albers, Georg Seidemann, Christian Geissler, Richard Patten | 2022-08-23 |
| 11239199 | Package stacking using chip to wafer bonding | Georg Seidemann, Christian Geissler, Sven Albers, Andreas Wolter, Marc Dittes +1 more | 2022-02-01 |