Issued Patents 2022
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11239199 | Package stacking using chip to wafer bonding | Georg Seidemann, Klaus Reingruber, Christian Geissler, Sven Albers, Andreas Wolter +1 more | 2022-02-01 |
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11239199 | Package stacking using chip to wafer bonding | Georg Seidemann, Klaus Reingruber, Christian Geissler, Sven Albers, Andreas Wolter +1 more | 2022-02-01 |