Issued Patents 2022
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11505450 | Integration of stress decoupling and particle filter on a single wafer or in combination with a waferlevel package | Florian BRANDL, Robert Gruenberger, Claus Waechter, Bernhard Winkler | 2022-11-22 |
| 11424209 | Wafer level package structure with internal conductive layer | Sven Albers, Klaus Reingruber, Georg Seidemann, Richard Patten | 2022-08-23 |
| 11376998 | Fastening device for a child's seat in a motor vehicle, and motor vehicle with such a fastening device | Uemit Kilincsoy | 2022-07-05 |
| 11239199 | Package stacking using chip to wafer bonding | Georg Seidemann, Klaus Reingruber, Sven Albers, Andreas Wolter, Marc Dittes +1 more | 2022-02-01 |