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Resonant LC tank package and method of manufacture |
Saravana Maruthamuthu, Andreas Augustin |
2022-12-06 |
| 11469213 |
Systems, methods, and apparatuses for implementing reduced height semiconductor packages for mobile electronics |
Georg Seidemann, Thomas Wagner, Klaus Reingruber, Bernd Waidhas |
2022-10-11 |
| 11410908 |
Integrated circuit devices with front-end metal structures |
Reinhard Mahnkopf, Sonja Koller |
2022-08-09 |
| 11374323 |
Patch antennas stitched to systems in packages and methods of assembling same |
Andreas Augustin, Sonja Koller, Bernd Waidhas, Georg Seidemann, Stephan Stoeckl +2 more |
2022-06-28 |
| 11270941 |
Bare-die smart bridge connected with copper pillars for system-in-package apparatus |
Georg Seidemann, Thomas Wagner, Bernd Waidhas |
2022-03-08 |
| 11250981 |
Vertical inductor for WLCSP |
Thorsten Meyer, Gerhard Knoblinger |
2022-02-15 |
| 11239199 |
Package stacking using chip to wafer bonding |
Georg Seidemann, Klaus Reingruber, Christian Geissler, Sven Albers, Marc Dittes +1 more |
2022-02-01 |