Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11424209 | Wafer level package structure with internal conductive layer | Klaus Reingruber, Georg Seidemann, Christian Geissler, Richard Patten | 2022-08-23 |
| 11239199 | Package stacking using chip to wafer bonding | Georg Seidemann, Klaus Reingruber, Christian Geissler, Andreas Wolter, Marc Dittes +1 more | 2022-02-01 |