| 11469213 |
Systems, methods, and apparatuses for implementing reduced height semiconductor packages for mobile electronics |
Thomas Wagner, Klaus Reingruber, Bernd Waidhas, Andreas Wolter |
2022-10-11 |
| 11456116 |
Magnetic coils in locally thinned silicon bridges and methods of assembling same |
Andreas Augustin, Bernd Waidhas, Sonja Koller, Reinhard Mahnkopf |
2022-09-27 |
| 11424209 |
Wafer level package structure with internal conductive layer |
Sven Albers, Klaus Reingruber, Christian Geissler, Richard Patten |
2022-08-23 |
| 11374323 |
Patch antennas stitched to systems in packages and methods of assembling same |
Andreas Augustin, Sonja Koller, Bernd Waidhas, Andreas Wolter, Stephan Stoeckl +2 more |
2022-06-28 |
| 11270941 |
Bare-die smart bridge connected with copper pillars for system-in-package apparatus |
Thomas Wagner, Andreas Wolter, Bernd Waidhas |
2022-03-08 |
| 11239199 |
Package stacking using chip to wafer bonding |
Klaus Reingruber, Christian Geissler, Sven Albers, Andreas Wolter, Marc Dittes +1 more |
2022-02-01 |