| 11508637 |
Fan out package and methods |
Lizabeth Keser, Thomas Ort, Thomas Wagner |
2022-11-22 |
| 11469213 |
Systems, methods, and apparatuses for implementing reduced height semiconductor packages for mobile electronics |
Georg Seidemann, Thomas Wagner, Klaus Reingruber, Andreas Wolter |
2022-10-11 |
| 11456116 |
Magnetic coils in locally thinned silicon bridges and methods of assembling same |
Andreas Augustin, Sonja Koller, Reinhard Mahnkopf, Georg Seidemann |
2022-09-27 |
| 11404339 |
Fan out package with integrated peripheral devices and methods |
Lizabeth Keser, Thomas Ort, Thomas Wagner |
2022-08-02 |
| 11380616 |
Fan out package-on-package with adhesive die attach |
David O'Sullivan, Thomas J. Huber |
2022-07-05 |
| 11374323 |
Patch antennas stitched to systems in packages and methods of assembling same |
Andreas Augustin, Sonja Koller, Georg Seidemann, Andreas Wolter, Stephan Stoeckl +2 more |
2022-06-28 |
| 11270941 |
Bare-die smart bridge connected with copper pillars for system-in-package apparatus |
Georg Seidemann, Thomas Wagner, Andreas Wolter |
2022-03-08 |