Issued Patents 2022
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11527507 | Microelectronic packages with high integration microelectronic dice stack | — | 2022-12-13 |
| 11424209 | Wafer level package structure with internal conductive layer | Sven Albers, Klaus Reingruber, Georg Seidemann, Christian Geissler | 2022-08-23 |
| 11239199 | Package stacking using chip to wafer bonding | Georg Seidemann, Klaus Reingruber, Christian Geissler, Sven Albers, Andreas Wolter +1 more | 2022-02-01 |