Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11505450 | Integration of stress decoupling and particle filter on a single wafer or in combination with a waferlevel package | Florian BRANDL, Christian Geissler, Claus Waechter, Bernhard Winkler | 2022-11-22 |
| 11247895 | Segmented stress decoupling via frontside trenching | Florian BRANDL, Wolfram Langheinrich | 2022-02-15 |