Issued Patents 2022
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11495686 | Semiconductor device and method for fabricating the same | Chi-Hsuan Tang, Chung-Ting Huang, Bo-Shiun Chen, Yu-Shu Lin | 2022-11-08 |
| 11488891 | Method of forming conductive bumps for cooling device connection and semiconductor device | You-Hua Chou, Yi-Jen Lai, Perre Kao | 2022-11-01 |
| 11404341 | Package and package-on-package structure having elliptical columns and ellipsoid joint terminals | Sheng-Huan Chiu, Chen-Shien Chen, Kuo-Chio Liu, Kuo-Hui Chang, Chung-Yi Lin +2 more | 2022-08-02 |
| 11302646 | Semiconductor device package | Hao-Chih Hsieh, Tzu-Cheng Lin | 2022-04-12 |
| 11264273 | Electron migration control in interconnect structures | Kai-Shiung Hsu, Ding-I Liu, Jyh-Nan Lin | 2022-03-01 |
| 11217548 | Semiconductor device structure and manufacturing method | Li-Guo Lee, Yung S. Liu, Yi-Chen Liu, Yi-Jen Lai, Hsi-Kuei Cheng | 2022-01-04 |