Issued Patents 2022
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11322397 | Method of manufacturing semiconductor devices including formation of adhesion enhancement layer | Hsiao-Min Chen, Jyh-Nan Lin, Ding-I Liu | 2022-05-03 |
| 11315829 | Amorphous layers for reducing copper diffusion and method forming same | Jyh-Nan Lin, Chia-Yu Wu, Ding-I Liu | 2022-04-26 |
| 11264273 | Electron migration control in interconnect structures | Chun-Jen Chen, Ding-I Liu, Jyh-Nan Lin | 2022-03-01 |