Issued Patents 2022
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11322397 | Method of manufacturing semiconductor devices including formation of adhesion enhancement layer | Hsiao-Min Chen, Kai-Shiung Hsu, Ding-I Liu | 2022-05-03 |
| 11315829 | Amorphous layers for reducing copper diffusion and method forming same | Chia-Yu Wu, Kai-Shiung Hsu, Ding-I Liu | 2022-04-26 |
| 11264273 | Electron migration control in interconnect structures | Chun-Jen Chen, Kai-Shiung Hsu, Ding-I Liu | 2022-03-01 |
| 11264467 | Semiconductor device having multi-layer diffusion barrier and method of making the same | Ding-I Liu, Yuh-Ta Fan | 2022-03-01 |