Issued Patents 2022
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11322397 | Method of manufacturing semiconductor devices including formation of adhesion enhancement layer | Jyh-Nan Lin, Kai-Shiung Hsu, Ding-I Liu | 2022-05-03 |
HC
Hsiao-Min Chen
Overall (2022): #428,855 of 548,613Top 80%
1
Patents 2022