Issued Patents 2022
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11342164 | High density plasma chemical vapor deposition chamber and method of using | Wei Wu, Wen-Long Lee | 2022-05-24 |
| 11322397 | Method of manufacturing semiconductor devices including formation of adhesion enhancement layer | Hsiao-Min Chen, Jyh-Nan Lin, Kai-Shiung Hsu | 2022-05-03 |
| 11315829 | Amorphous layers for reducing copper diffusion and method forming same | Jyh-Nan Lin, Chia-Yu Wu, Kai-Shiung Hsu | 2022-04-26 |
| 11264273 | Electron migration control in interconnect structures | Chun-Jen Chen, Kai-Shiung Hsu, Jyh-Nan Lin | 2022-03-01 |
| 11264467 | Semiconductor device having multi-layer diffusion barrier and method of making the same | Jyh-Nan Lin, Yuh-Ta Fan | 2022-03-01 |