CL

Chung-Yi Lin

TSMC: 2 patents #1,228 of 3,577Top 35%
NU National Taiwan University: 1 patents #28 of 192Top 15%
Overall (2022): #170,715 of 548,613Top 35%
2
Patents 2022

Issued Patents 2022

Showing 1–2 of 2 patents

Patent #TitleCo-InventorsDate
11404341 Package and package-on-package structure having elliptical columns and ellipsoid joint terminals Sheng-Huan Chiu, Chun-Jen Chen, Chen-Shien Chen, Kuo-Chio Liu, Kuo-Hui Chang +2 more 2022-08-02
11282843 Memory device, SRAM cell, and manufacturing method thereof Hung-Yu Ye, Yun-Ju PAN, Chee-Wee Liu 2022-03-22