Issued Patents 2022
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11469203 | Method for forming package structure with a barrier layer | Cheng-Hung Chen, Yu-Nu Hsu, Chun-Chen Liu, Heng-Chi Huang, Chien-Chen Li +7 more | 2022-10-11 |
| 11437361 | LTHC as charging barrier in InFO package formation | Yi-Jen Lai, Lin Chung-Yi, Hsi-Kuei Cheng, Chen-Shien Chen | 2022-09-06 |
| 11404341 | Package and package-on-package structure having elliptical columns and ellipsoid joint terminals | Sheng-Huan Chiu, Chun-Jen Chen, Chen-Shien Chen, Kuo-Hui Chang, Chung-Yi Lin +2 more | 2022-08-02 |
| 11257797 | Package on package structure | Dong Shen, Chen-Shien Chen, Hsi-Kuei Cheng, Yi-Jen Lai | 2022-02-22 |