Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11469162 | Plurality of vertical heat conduction elements attached to metal film | Hao-Lin Yen, Yong-Zhong Hu | 2022-10-11 |
| 11469203 | Method for forming package structure with a barrier layer | Cheng-Hung Chen, Yu-Nu Hsu, Chun-Chen Liu, Chien-Chen Li, Shih-Yen Chen +7 more | 2022-10-11 |