Issued Patents 2022
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11469203 | Method for forming package structure with a barrier layer | Cheng-Hung Chen, Yu-Nu Hsu, Chun-Chen Liu, Heng-Chi Huang, Shih-Yen Chen +7 more | 2022-10-11 |
CL
Chien-Chen Li
Overall (2022): #497,923 of 548,613Top 95%
1
Patents 2022