Issued Patents 2022
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11527504 | Conductive external connector structure and method of forming | Meng-Fu Shih, Chun-Yen Lo, Cheng-Lin Huang, Wen-Ming Chen, Chien-Ming Huang +8 more | 2022-12-13 |
| 11469198 | Semiconductor device manufacturing method and associated semiconductor die | Ming-Ho Tsai, Jyun-Hong Chen, Chun-Chen Liu, Peng Chen, Wen-Hao Cheng +1 more | 2022-10-11 |
| 11469203 | Method for forming package structure with a barrier layer | Cheng-Hung Chen, Chun-Chen Liu, Heng-Chi Huang, Chien-Chen Li, Shih-Yen Chen +7 more | 2022-10-11 |