Issued Patents 2022
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11488891 | Method of forming conductive bumps for cooling device connection and semiconductor device | You-Hua Chou, Chun-Jen Chen, Perre Kao | 2022-11-01 |
| 11437361 | LTHC as charging barrier in InFO package formation | Lin Chung-Yi, Hsi-Kuei Cheng, Chen-Shien Chen, Kuo-Chio Liu | 2022-09-06 |
| 11404341 | Package and package-on-package structure having elliptical columns and ellipsoid joint terminals | Sheng-Huan Chiu, Chun-Jen Chen, Chen-Shien Chen, Kuo-Chio Liu, Kuo-Hui Chang +2 more | 2022-08-02 |
| 11257797 | Package on package structure | Dong Shen, Chen-Shien Chen, Kuo-Chio Liu, Hsi-Kuei Cheng | 2022-02-22 |
| 11217548 | Semiconductor device structure and manufacturing method | Li-Guo Lee, Yung S. Liu, Yi-Chen Liu, Chun-Jen Chen, Hsi-Kuei Cheng | 2022-01-04 |