Issued Patents 2022
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11488891 | Method of forming conductive bumps for cooling device connection and semiconductor device | You-Hua Chou, Yi-Jen Lai, Chun-Jen Chen | 2022-11-01 |
PK
Perre Kao
Overall (2022): #303,294 of 548,613Top 60%
1
Patents 2022