Issued Patents 2022
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11401381 | Modified silicone compound, and thermosetting resin composition, prepreg, laminate plate and printed wiring board using same | Tomohiko KOTAKE, Masato Miyatake, Shunsuke Nagai, Shintaro Hashimoto, Yasuo Inoue +1 more | 2022-08-02 |
| 11359055 | Thermosetting resin composition, prepreg, laminate and multilayer printed wiring board | Takao Tanigawa, Yasuyuki Mizuno, Tomio Fukuda, Yuki Nagai | 2022-06-14 |
| 11333288 | Aerogel laminate and thermal insulation material | Tomohiko KOTAKE, Masato Miyatake, Chisato KIKKAWA, Hiroyuki Izumi | 2022-05-17 |
| 11286346 | Resin composition, support with resin layer, prepreg, laminate, multilayered printed wiring board, and printed wiring board for millimeter-wave radar | Takao Tanigawa, Tetsuroh Irino, Yuusuke Kondou, Yuichi Shimayama, Etsuo Mizushima +2 more | 2022-03-29 |
| 11220579 | Sol composition | Tomohiko KOTAKE, Masato Miyatake | 2022-01-11 |