Issued Patents 2022
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11377546 | Resin composition, laminate sheet, and multilayer printed wiring board | Tetsuroh Irino, Minoru Kakitani, Kouji Morita | 2022-07-05 |
| 11359055 | Thermosetting resin composition, prepreg, laminate and multilayer printed wiring board | Yasuyuki Mizuno, Tomio Fukuda, Yuki Nagai, Hikari Murai | 2022-06-14 |
| 11339251 | Resin composition, resin film, laminate, multilayer printed wiring board and method for producing multilayer printed wiring board | Yuki Nagai, Tetsuroh Irino, Yuusuke Kondou, Tomio Fukuda, Etsuo Mizushima | 2022-05-24 |
| 11286346 | Resin composition, support with resin layer, prepreg, laminate, multilayered printed wiring board, and printed wiring board for millimeter-wave radar | Tetsuroh Irino, Yuusuke Kondou, Yuichi Shimayama, Etsuo Mizushima, Tomio Fukuda +2 more | 2022-03-29 |