Issued Patents 2022
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11377546 | Resin composition, laminate sheet, and multilayer printed wiring board | Takao Tanigawa, Minoru Kakitani, Kouji Morita | 2022-07-05 |
| 11339251 | Resin composition, resin film, laminate, multilayer printed wiring board and method for producing multilayer printed wiring board | Yuki Nagai, Yuusuke Kondou, Tomio Fukuda, Etsuo Mizushima, Takao Tanigawa | 2022-05-24 |
| 11286346 | Resin composition, support with resin layer, prepreg, laminate, multilayered printed wiring board, and printed wiring board for millimeter-wave radar | Takao Tanigawa, Yuusuke Kondou, Yuichi Shimayama, Etsuo Mizushima, Tomio Fukuda +2 more | 2022-03-29 |