Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11339251 | Resin composition, resin film, laminate, multilayer printed wiring board and method for producing multilayer printed wiring board | Yuki Nagai, Tetsuroh Irino, Yuusuke Kondou, Tomio Fukuda, Takao Tanigawa | 2022-05-24 |
| 11286346 | Resin composition, support with resin layer, prepreg, laminate, multilayered printed wiring board, and printed wiring board for millimeter-wave radar | Takao Tanigawa, Tetsuroh Irino, Yuusuke Kondou, Yuichi Shimayama, Tomio Fukuda +2 more | 2022-03-29 |